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Select Thick Film Services
Select Passive/Active Laser Trim Services
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Select Die Attach Services
Select Void Free Vacuum Lamination Services
Select Wire Bonding Services
Select Lead & Bump Attachment Services
Select Die Coating Services
Select Design & Development Services
Select Test Services
Select Machine Shop and Proto-Typing Services
Select Additional Services
 

 

  Did You Know?

 

FME in Florida took over some operations once owned by Nortel, C-MAC and Solectron. Now Florida MicroElectronics is independent and better than ever.
 

  Fact!

 

FME is located in Palm Beach county in South Florida only minutes from Palm Beach International Airport.

 

  History

 

FME was created in 2005 but has a long lineage that dates back to 1981 and has a 40,000 sq. ft. state of the art manufacturing site in South Florida.
 

  About FME

 

FME is an acronym for Florida MicroElectronics, a partnership of experienced electronic engineers with a combined 150 years in the industry.
 
FME has three fully automated, flexible SMT lines with low to high volume capability.

FME offers Vacuum Reflow which delivers void free solder die attachment.

FME offers quick turn prototype services. Call a technical solutions representative today!
 

 To Speak with a technical solutions representative call
(561).818.8150

 

 

 

 

 

  

 

Core Capabilities

Thick Film Manufacturing  

*

 Ekra Automated Cassette to Cassette Print Dry Islands (2)
* AMI 885 Manual Print Equipment (3)
* AMI Dryer 16' (1)
* Furnaces with Auto Load/Unload
  - SierraTherm 18" Belt - 14 zone (1)
  - W&J 18" Belt – 11 zone (1)

 

 

 

 

 

Passive/Active Laser Trim  
* CLS 37 Laser Trim w/ Step & Repeat – Auto Load/Unload Robot (3)
* CLS 77 Wide Field Laser Trim w/ Auto Load/Unload Robot (1)
* Trim Tolerances of 0.5% Absolute
* Resistor Matching of 0.1%
* Auto SPC Data Collection and Analysis
* CLS 960 (1), ESI 4990 (1)

 

 

 

 

 

 

 

 

 

SMT & Thru-Hole Assembly Lines  
* Sanyo TPM 5000 Solder Printer
* Cyberoptics SE2000 Solder Volume Measurement
* Sanyo TCM 3500Z High Speed Chip Shooter
* Sanyo TIM 5000 Flexible Placer w/ Flip Chip Capability
* Heller 1800 Forced Convection Reflow Oven w/ Nitrogen Inerting
* Auto Cassette Loader / MPM UP2000 Flux Printer
* Contact Systems Thru-Hole
* Technical Devices Wave Solder

Epoxy Die Attach  
* Conductive Epoxy Die Attach
* Vacuum Lamination with Film Epoxies
* Non Conductive Die Attach
* Die on Die Epoxy Attach
* Flip Chip

Vacuum Reflow  
* Fluxless Solder Die Attach – Void Free
  - Tin/Lead
  - Tin/Silver 
  - Gold/Tin

Wire/Ribbon Bonding  
* Equipment
  - Palomar 2470-5 Wedge Bonders (3)
  - Orthodyne 360C Heavy Aluminum (4)
  - Palomar 2460-5 Gold Ball Bonder (2)
 
-
 Dage 4000 Shear and Pull Tester (2)
* Types of Wire Bonding
  - .001 - .003” & .005 - .020” Aluminum Ultrasonic Wedge Bonding
  - .001 - .003” Thermosonic Gold Wedge/Ball Ribbon Bonding
  - Parallel Gap Wire Welding
Lead/Bump Attach  
* Leadframe Insertion
  - Die-Tech 3002-1/2 SIP Inserters (3)
  - Die-Tech 4004-1 DIP Leadframe Inserter (1)
* Leadframe Soldering
  - Comatel Comwave Nitrogen 9180 In-Line Soldering System (1)
* Pin Insertion / Solder Bumping

Coatings  
* Epoxy Die Coating
* Dielectric Syl-Gel Coating
* Mechanical Covers
* Conformal Coatings
Design/Development  
* In House Computer Aided Design Capability
* AutoCAD
* Inventor
* PCB Design / Layout / Gerber Files

Testing Solutions  
* Functional Test: 10 Hz - 27 GHz
* HI POT Testing
* Automated Hot / Cold Testing
*

Environmental
 
  • Burn - in
  • Environmental Stress Screening (ESS)
  • Temperature / Bias Humidity Cycling
* In House Test Fixturing
* In House Test PCB Layout
* RF Lab Station
Machine Shop
* Fast Turn Capabilities
* Rapid Design & Development
* In House Proto-Typing
* Die / Machining / Tool Making
* In House Milling
* Final Assembly Alterations
   
Additional Capabilities
* X-Ray Inspection
* Tape and Reel Packaging
  - Tape & Reel Stations, 3 with Video Microscope Inspection (6)
* Network Server for Data Collection
 
 

 
     
 
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